{"id":57430,"date":"2025-08-05T14:05:57","date_gmt":"2025-08-05T18:05:57","guid":{"rendered":"https:\/\/ieeeusa.org\/?post_type=tribe_events&#038;p=57430"},"modified":"2025-08-25T11:18:27","modified_gmt":"2025-08-25T15:18:27","slug":"next-generation-microelectronics-manufacturing","status":"publish","type":"tribe_events","link":"https:\/\/ieeeusa.org\/events\/next-generation-microelectronics-manufacturing\/","title":{"rendered":"Next Generation Microelectronics Manufacturing: Stacking the Future with Mixed-Materials 3DHI"},"content":{"rendered":"<div class=\"fusion-fullwidth fullwidth-box fusion-builder-row-1 fusion-flex-container nonhundred-percent-fullwidth non-hundred-percent-height-scrolling\" style=\"--awb-border-radius-top-left:0px;--awb-border-radius-top-right:0px;--awb-border-radius-bottom-right:0px;--awb-border-radius-bottom-left:0px;--awb-flex-wrap:wrap;\" ><div class=\"fusion-builder-row fusion-row fusion-flex-align-items-flex-start fusion-flex-content-wrap\" style=\"max-width:calc( 1260px + 40px );margin-left: calc(-40px \/ 2 );margin-right: calc(-40px \/ 2 );\"><div class=\"fusion-layout-column fusion_builder_column fusion-builder-column-0 fusion_builder_column_1_1 1_1 fusion-flex-column\" style=\"--awb-bg-size:cover;--awb-width-large:100%;--awb-margin-top-large:0px;--awb-spacing-right-large:20px;--awb-margin-bottom-large:20px;--awb-spacing-left-large:20px;--awb-width-medium:100%;--awb-order-medium:0;--awb-spacing-right-medium:20px;--awb-spacing-left-medium:20px;--awb-width-small:100%;--awb-order-small:0;--awb-spacing-right-small:20px;--awb-spacing-left-small:20px;\"><div class=\"fusion-column-wrapper fusion-column-has-shadow fusion-flex-justify-content-flex-start fusion-content-layout-column\"><div class=\"fusion-text fusion-text-1\" style=\"--awb-text-transform:none;\"><div class=\"video-shortcode\"><iframe title=\"IEEE-USA Webinar: Next Generation Microelectronics Manufacturing (A Special Presentation by DARPA)\" width=\"1260\" height=\"709\" src=\"https:\/\/www.youtube.com\/embed\/ex3eKV8bCHQ?feature=oembed\" frameborder=\"0\" allow=\"accelerometer; autoplay; clipboard-write; encrypted-media; gyroscope; picture-in-picture; web-share\" referrerpolicy=\"strict-origin-when-cross-origin\" allowfullscreen><\/iframe><\/div>\n<p><strong><br \/>\nPresenter: <\/strong>Michael Holmes<\/p>\n<h2>Overview<\/h2>\n<p>As technologies push the limits of traditional silicon, the U.S. faces a critical challenge: how to continue delivering high-bandwidth, energy-efficient, multifunctional microelectronics essential for advanced technologies. Conventional 2D scaling is reaching physical and economic limits, and while industry is pursuing advanced packaging, the integration of mixed materials \u2013 beyond silicon \u2013 remains largely untapped. Yet this integration is essential for achieving the order-of-magnitude improvements that next-generation capabilities will require.<\/p>\n<p>Join <strong>Michael Holmes<\/strong> from DARPA\u2019s Microsystems Technology Office, to learn how DARPA\u2019s <a href=\"https:\/\/www.darpa.mil\/research\/programs\/next-generation-microelectronics\" target=\"_blank\" rel=\"noopener\">Next Generation Microelectronics Manufacturing (NGMM)<\/a> program is addressing this challenge. NGMM is establishing the nation\u2019s first open-access center for U.S.-based 3D heterogeneous integration (3DHI) focused on mixed materials integration to leapfrog ahead of today\u2019s state of the art. In partnership with The University of Texas at Austin and its Texas Institute for Electronics (TIE), NGMM is developing a sustainable domestic hub for R&amp;D and pilot production, which will enable rapid prototyping and fabrication of advanced microsystems critical to future technological needs. Attendees will also learn about opportunities to engage with the NGMM community at the inaugural NGMM Summit this October in Austin, Texas.<\/p>\n<\/div><div class=\"fusion-text fusion-text-2\" style=\"--awb-text-transform:none;\"><h2>About the Presenter<\/h2>\n<p><b><img decoding=\"async\" class=\"lazyload alignleft wp-image-57431 size-thumbnail\" src=\"https:\/\/ieeeusa.org\/wp-content\/uploads\/2025\/08\/Michael_Holmes-175x175.jpg\" data-orig-src=\"https:\/\/ieeeusa.org\/wp-content\/uploads\/2025\/08\/Michael_Holmes-175x175.jpg\" alt=\"Michael Holmes\" width=\"175\" height=\"175\" srcset=\"data:image\/svg+xml,%3Csvg%20xmlns%3D%27http%3A%2F%2Fwww.w3.org%2F2000%2Fsvg%27%20width%3D%27175%27%20height%3D%27175%27%20viewBox%3D%270%200%20175%20175%27%3E%3Crect%20width%3D%27175%27%20height%3D%27175%27%20fill-opacity%3D%220%22%2F%3E%3C%2Fsvg%3E\" data-srcset=\"https:\/\/ieeeusa.org\/wp-content\/uploads\/2025\/08\/Michael_Holmes-66x66.jpg 66w, https:\/\/ieeeusa.org\/wp-content\/uploads\/2025\/08\/Michael_Holmes-100x100.jpg 100w, https:\/\/ieeeusa.org\/wp-content\/uploads\/2025\/08\/Michael_Holmes-175x175.jpg 175w, https:\/\/ieeeusa.org\/wp-content\/uploads\/2025\/08\/Michael_Holmes-200x200.jpg 200w, https:\/\/ieeeusa.org\/wp-content\/uploads\/2025\/08\/Michael_Holmes-250x250.jpg 250w, https:\/\/ieeeusa.org\/wp-content\/uploads\/2025\/08\/Michael_Holmes-275x275.jpg 275w, https:\/\/ieeeusa.org\/wp-content\/uploads\/2025\/08\/Michael_Holmes.jpg 300w\" data-sizes=\"auto\" data-orig-sizes=\"(max-width: 175px) 100vw, 175px\" \/><\/b><\/p>\n<p><strong>Mr. Michael Holmes<\/strong> is the managing director of the Next Generation Microelectronics Manufacturing (NGMM) program. Prior to joining DARPA in September 2024, Holmes was at Sandia National Laboratories for more than 21 years. In his most recent role at Sandia, he was the senior manager of the protective technologies organization focused on specialized hardware systems security research.<\/p>\n<p>Previously, Holmes was responsible for operation of the largest U.S. government microfabrication facilities for the National Nuclear Security Administration\u2019s Microsystems Engineering, Science, and Applications (MESA) Center. He held additional roles at MESA including senior manager for the Heterogeneous Integration &amp; RF Microsystems group, line manager for the Application Specific Integrated Circuits (ASIC) department, and mixed signal integrated circuit design engineer.<\/p>\n<h3>Areas of interest<\/h3>\n<ul>\n<li>Heterogeneous integration<\/li>\n<li>Microfabrication<\/li>\n<li>Integrated circuit design<\/li>\n<li>Secure microsystems research and development<\/li>\n<li>Sensors<\/li>\n<\/ul>\n<h3>Education<\/h3>\n<ul>\n<li>MS, Electrical Engineering, New Mexico State University<\/li>\n<li>BS, Electrical Engineering, New Mexico State University<\/li>\n<\/ul>\n<\/div><\/div><\/div><div class=\"fusion-layout-column fusion_builder_column fusion-builder-column-1 fusion_builder_column_1_1 1_1 fusion-flex-column\" style=\"--awb-padding-top:15px;--awb-padding-right:20px;--awb-padding-left:20px;--awb-bg-color:#f2f3f5;--awb-bg-color-hover:#f2f3f5;--awb-bg-blend:overlay;--awb-bg-size:cover;--awb-width-large:100%;--awb-margin-top-large:0px;--awb-spacing-right-large:20px;--awb-margin-bottom-large:20px;--awb-spacing-left-large:20px;--awb-width-medium:100%;--awb-order-medium:0;--awb-spacing-right-medium:20px;--awb-spacing-left-medium:20px;--awb-width-small:100%;--awb-order-small:0;--awb-spacing-right-small:20px;--awb-spacing-left-small:20px;\"><div class=\"fusion-column-wrapper fusion-column-has-shadow fusion-flex-justify-content-flex-start fusion-content-layout-column\"><div class=\"fusion-text fusion-text-3\" style=\"--awb-text-transform:none;\"><h3>Earn PDH Credits<\/h3>\n<p>U.S. IEEE members who have participated in an IEEE-USA Webinar can earn professional development hours (PDHs) from IEEE\u2019s Educational Activities Department by clicking <a href=\"http:\/\/innovationatwork.ieee.org\/ieee-usa\/\" target=\"_blank\" rel=\"noopener\">here<\/a>\u00a0to request a certificate.*<\/p>\n<p><em>*Please allow 7-10 days to receive a certificate.<\/em><\/p>\n<\/div><\/div><\/div>\n<\/div><\/div>\n","protected":false},"excerpt":{"rendered":"<p>Learn how DARPA\u2019s Next Generation Microelectronics Manufacturing (NGMM) program will help the U.S. continue to deliver high-bandwidth, energy-efficient, multifunctional microelectronics essential for advanced technologies.<\/p>\n","protected":false},"author":4,"featured_media":57434,"template":"","meta":{"_tribe_events_status":"","_tribe_events_status_reason":"","_tribe_events_is_hybrid":"","_tribe_events_is_virtual":"","_tribe_events_virtual_video_source":"","_tribe_events_virtual_embed_video":"","_tribe_events_virtual_linked_button_text":"","_tribe_events_virtual_linked_button":"","_tribe_events_virtual_show_embed_at":"","_tribe_events_virtual_show_embed_to":[],"_tribe_events_virtual_show_on_event":"","_tribe_events_virtual_show_on_views":"","_tribe_events_virtual_url":"","footnotes":"","_links_to":"","_links_to_target":""},"tags":[],"tribe_events_cat":[130,67,74],"class_list":["post-57430","tribe_events","type-tribe_events","status-publish","has-post-thumbnail","hentry","tribe_events_cat-career-archive","tribe_events_cat-career","tribe_events_cat-job-search","cat_career-archive","cat_career","cat_job-search"],"yoast_head":"<!-- This site is optimized with the Yoast SEO Premium plugin 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